| 常见技术参数（Technical Parameter) | ||
| 项目 project | 技术标准 Technology standard | |
| 层数 Layer number | 1-12 layers | |
| 材料 materials | CEM-3，FR-4 | |
| 板层 Layers thickness | 0.2mm-3.20m(8mil-126mil) | |
| 最小芯板厚 Min core material thickness | 0.1mm(4mil) | |
| 铜厚 Copper thickness | 1/2 oz min； 3 oz max | |
| 最小线宽间距 conductor line/space | 0.075mm(3mil) | |
| 最小钻孔径 Min drilling hole diameter | 0.20mm(10mil) | |
| 最小冲孔孔径 Min punched hole diameter | 0.9mm(35mil) | |
| 公差 tolerance |
钻孔孔位 Drilling hole position | ±0.075mm(3mil) |
| 线宽 Conductor line | ±0.05mm(2mil)or conductor line ±20﹪ | |
| 孔径 Hole diameter | PTH±0.075mm(3mil) NPTH±0.05mm(2mil) |
|
| 外型公差 Contour Tolerance | 铣床：milling machine±0.15mm(6mil) 冲床：punch±0.10mm(4mil) |
|
| 翘曲度 Warpage degree | 0.70﹪-1.5﹪ | |
| 焊盘表面处理 Round pad surface treatment | Nickel/Gold Plating/Entek/Hot Air Leveling | |
| 绝缘电阻 Insulation resistance | 10K-20MΩ | |
| 传导电阻 Conduct resistance | ﹤50Ω | |
| 测试电压 Test voltage | 300v | |
| V cut | 拼板尺寸 connect_board size | 110*100mm(min.)660*600mm(max.) |
| 板厚 Board thickness | 0.6mm(24mil)min. | |
| 保留厚度 Reserved thickness | 0.3mm(12mil)min. | |
| 公差 tolerance | ±0.1mm(4mil) | |
| 槽宽 Slot width | 0.50mm(20mil)max. | |
| 槽到槽 Between slot and slot | 10mm min | |
| 槽到线 Between slot and conductor | 0.5mm(20mil)min | |
| 槽 slot | Slot size tlo.≧2W tolerance | PTHL:±0.15mm(6mil) W:±0.1mm(4mil) |
| NPTH: ±0.125mm(5mil) W:±0.1mm(4mil) |
||
| 最小孔到圆形距离 Space form min hole to round pad |
PTH Hole: 0.13mm(5mil) NPTH Hole: 0.18(7mil) |
|
| 多层板 Multi layer board |
圆形偏差 Tolerance of Hole and round pad |
0.075mm(3mil) |
| 层间偏差 Tolerance of layers | 4 layers: 0.15mm(6mil)max 6 layers: 0.025mm(10mil)max. |
|
| 最小孔径至内层圆形距离 space form the smallest hole to the core layer |
0.25mm(10mil) | |
| 最小板边到内圆形距离 Space form min board edge to inner round pad |
0.25mm(10mil) | |
| 板厚公差 Board thickness tolerance |
6 layers: ±0.15mm(6mil) 6 layers: ±0.15mm(6mil) |
|
| 特性阻抗 Characteristic impedance | 60Ω±10﹪ | |
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